NickelMaghrebV1, France, Analysis, bibRecord, 000038

Effect of alloying elements Mo and W on Ni silicides formation

Identifieur interne : 000038 ( France/Analysis ); précédent : 000037; suivant : 000039

Effect of alloying elements Mo and W on Ni silicides formation

Auteurs : A. Derafa [Algérie] ; G. Tellouche [Algérie] ; K. Hoummada [France] ; A. Bouabellou [Algérie] ; D. Mangelinck [France]

Source :

Microelectronic engineering [ 0167-9317 ] ; 2014.

RBID : Pascal:14-0138912

Descripteurs français

Pascal (Inist)
- Elément alliage, Alliage(action), In situ, Diffraction RX, Résistivité couche, RBS, Texture, Conductivité électrique, Phénomène transitoire, Haute température, Molybdène, Siliciure de nickel, Nickel, Siliciure de molybdène, 7363, MoSi2, NiSi.
Wicri :
- topic : Molybdène, Nickel.

English descriptors

KwdEn :
- Alloying, Alloying elements, Electrical conductivity, High temperature, In situ, Molybdenum, Molybdenum silicide, Nickel, Nickel silicide, RBS, Sheet resistivity, Texture, Transients, XRD.

Abstract

The effect of alloying Mo and W elements on the formation and stability of the Ni silicides are studied using in situ and ex situ measurements by X-ray diffraction (XRD), sheet resistance (Rs) and Rutherford back scattering (RBS). The results show that a low Mo concentration in Ni layer does not affect the sequence, texture and resistivity compared to the Ni/Si system. However, the addition of 10% Mo and 5% W in Ni layer leads to the suppression of a transient phase. For Ni (10%W), a (Ni_xSi_y) phase appears in the end of Ni consumption and the sheet resistance increases when this phase is formed. In all cases, ex situ XRD and RBS shows that, at high temperature, MoSi₂ and WSi₂ are formed at the surface before NiSi₂. Low resistances films are obtained even for temperatures as high as 900 °C for the samples containing 10% Mo, 5% and 10% W.

Affiliations:

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Pascal:14-0138912

Le document en format XML

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<term>Alloying elements</term>
<term>Electrical conductivity</term>
<term>High temperature</term>
<term>In situ</term>
<term>Molybdenum</term>
<term>Molybdenum silicide</term>
<term>Nickel</term>
<term>Nickel silicide</term>
<term>RBS</term>
<term>Sheet resistivity</term>
<term>Texture</term>
<term>Transients</term>
<term>XRD</term>
</keywords>
<keywords scheme="Pascal" xml:lang="fr"><term>Elément alliage</term>
<term>Alliage(action)</term>
<term>In situ</term>
<term>Diffraction RX</term>
<term>Résistivité couche</term>
<term>RBS</term>
<term>Texture</term>
<term>Conductivité électrique</term>
<term>Phénomène transitoire</term>
<term>Haute température</term>
<term>Molybdène</term>
<term>Siliciure de nickel</term>
<term>Nickel</term>
<term>Siliciure de molybdène</term>
<term>7363</term>
<term>MoSi2</term>
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<front><div type="abstract" xml:lang="en">The effect of alloying Mo and W elements on the formation and stability of the Ni silicides are studied using in situ and ex situ measurements by X-ray diffraction (XRD), sheet resistance (Rs) and Rutherford back scattering (RBS). The results show that a low Mo concentration in Ni layer does not affect the sequence, texture and resistivity compared to the Ni/Si system. However, the addition of 10% Mo and 5% W in Ni layer leads to the suppression of a transient phase. For Ni (10%W), a (Ni<sub>x</sub>
Si<sub>y</sub>
) phase appears in the end of Ni consumption and the sheet resistance increases when this phase is formed. In all cases, ex situ XRD and RBS shows that, at high temperature, MoSi<sub>2</sub>
 and WSi<sub>2</sub>
 are formed at the surface before NiSi<sub>2</sub>
. Low resistances films are obtained even for temperatures as high as 900 °C for the samples containing 10% Mo, 5% and 10% W.</div>
</front>
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Effect of alloying elements Mo and W on Ni silicides formation

Effect of alloying elements Mo and W on Ni silicides formation

Source :

Descripteurs français

English descriptors

Abstract

Links toward previous steps (curation, corpus...)

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Le document en format XML

Pour manipuler ce document sous Unix (Dilib)

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